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MNE
Produces vital parts of semiconductor equipments

NANOPURE FFKM O-RINGS

NANOPURE ® HX-5

For Semiconductor Thermal Processes

NANOPURE HX-5是半导体高温工程用,特别开发的产品。
特别是在OXIDATION、DIFFUSION FURNACE、LPCVD等高温工程,提供非常优秀的热稳定性。

NANOPURE HX-5具备低的OUTGASSING与优秀的(低的)永久压缩复原率,在高温度下,具有优秀的机械性强度,
可用于全部固定部及驱动部。

NANOPURE HX-5可在最大325度下进行使用。

NANOPURE® 9023SP
Features & Benefit
  • Outstanding thermal stability
  • Excellent (low) compression set properties
  • Very low outgassing
  • Excellent seal force retention properties
Suggested Applications
  • Quartz tube seals
  • Center ring seals
  • Plenum seals
  • Fittings
  • Chamber seals
Plasma Resistance Test Result
  • NANOPURE® HX-5

  • FFKM C

  • FFKM B

Surface after Plasma Resistance Test (FE-SEM x 1,000)
Typical Physical Properties
Typical Physical Properties
Color Black
Polymer Type Perfluoro
-elastomer
Hardness1), Shore A 76
Tensile Strength at Break2), MPa 16.2
Elongation at Break3), % 205
100% Modulus4), MPa 7.0
Compression Set5), % 70 hours @ 204℃ 8
Compression Set5), % 70 hours @ 250℃ 13
Compression Set5), % 70 hours @ 300℃ 27
Compression Set5), % 70 hours @ 325℃ 43
Maximum Continuous Service,
Temperature, ℃
325
  • 1) ASTM D1415 (ISO 48)
  • 2) ASTM D412 (ISO 37)
  • 3) ASTM D412 (ISO 37)
  • 4) ASTM D412 (ISO 37)
  • 5) ASTM D395 Method B ; (ISO 815)