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Produces vital parts of semiconductor equipments

NANOPURE FFKM O-RINGS

NANOPURE ® HX-5

For Semiconductor Thermal Processes

NANOPURE ® HX-5 is a product especially developed for high-temperature processes of semiconductor.
In particular, it provides a very outstanding thermal stability in high-temperature processes such as Oxidation,
Diffusion furnace, LPCVD. etc.

NANOPURE ® HX-5 has low outgassing and excellent (low) permanent compression recovery rates, accompanied by outstanding
mechanical strengths at a high temperature, making it suitable for both stationary unit and driving unit.

NANOPURE ® HX-5 is usable at temperatures up to a maximum of 325℃.

NANOPURE® 9023SP
Features & Benefit
  • Outstanding thermal stability
  • Excellent (low) compression set properties
  • Very low outgassing
  • Excellent seal force retention properties
Suggested Applications
  • Quartz tube seals
  • Center ring seals
  • Plenum seals
  • Fittings
  • Chamber seals
Plasma Resistance Test Result
  • NANOPURE® HX-5

  • FFKM C

  • FFKM B

Surface after Plasma Resistance Test (FE-SEM x 1,000)
Typical Physical Properties
Typical Physical Properties
Color Black
Polymer Type Perfluoro
-elastomer
Hardness1), Shore A 76
Tensile Strength at Break2), MPa 16.2
Elongation at Break3), % 205
100% Modulus4), MPa 7.0
Compression Set5), % 70 hours @ 204℃ 8
Compression Set5), % 70 hours @ 250℃ 13
Compression Set5), % 70 hours @ 300℃ 27
Compression Set5), % 70 hours @ 325℃ 43
Maximum Continuous Service,
Temperature, ℃
325
  • 1) ASTM D1415 (ISO 48)
  • 2) ASTM D412 (ISO 37)
  • 3) ASTM D412 (ISO 37)
  • 4) ASTM D412 (ISO 37)
  • 5) ASTM D395 Method B ; (ISO 815)