For Semiconductor Thermal Processes
NANOPURE ® HX-5 is a product especially developed for high-temperature processes of semiconductor.
In particular, it provides a very outstanding thermal stability in high-temperature processes such as Oxidation,
Diffusion furnace, LPCVD. etc.
NANOPURE ® HX-5 has low outgassing and excellent (low) permanent compression recovery rates, accompanied by outstanding
mechanical strengths at a high temperature, making it suitable for both stationary unit and driving unit.
NANOPURE ® HX-5 is usable at temperatures up to a maximum of 325℃.
|Hardness1), Shore A||76|
|Tensile Strength at Break2), MPa||16.2|
|Elongation at Break3), %||205|
|100% Modulus4), MPa||7.0|
|Compression Set5), % 70 hours @ 204℃||8|
|Compression Set5), % 70 hours @ 250℃||13|
|Compression Set5), % 70 hours @ 300℃||27|
|Compression Set5), % 70 hours @ 325℃||43|
|Maximum Continuous Service,