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Produces vital parts of semiconductor equipments

NANOPURE FFKM O-RINGS

NANOPURE ® HX-7

Outstanding Plasma Resistance for Corrosive Environments

NANOPURE® HX-7 is a grey-colored perfluoroelastomer developed as a high-performance material for
the use in harsh processes of semiconductor and display industries.

NANOPURE® HX-7 has been designed to minimize problems due to particle generation by low etching rates in
a highly corrosive environment caused by plasma.
It also provides high process yields by extending the life of seals with excellent thermal characteristics
and permanent compression recovery rates.

NANOPURE® HX-7 is usable at temperatures up to a maximum of 325℃.

NANOPURE® 9023SP
Features & Benefit
  • Outstanding plasma resistance in highly corrosive environments
  • Excellent thermal stability
  • Excellent (low) compression set properties
  • Excellent seal force retention properties
Suggested Applications
  • Chamber seals
  • Quartz tube seals
  • Center ring seals
  • Plenum seals
  • Fittings
Plasma Resistance Test Result

< Conditions >

  • - Gas flow : 150 sccm
  • - Pressure : NF3 150mT, O2 380mT
  • - RF Power : 1,100W
  • - Run time : 30 min.
  • - Temperature : 200℃
Typical Physical Properties
Typical Physical Properties
Color Gray
Polymer Type FFKM
Hardness1), Shore A 75
Tensile Strength at Break2), MPa 11.2
Elongation at Break3), % 202
100% Modulus4), MPa 6.1
Compression Set5), % 70 hours @ 204℃ 12
Compression Set5), % 70 hours @ 300℃ 34
Compression Set5), % 70 hours @ 325℃ 52
Maximum Continuous Service,
Temperature, ℃
325
  • 1) ASTM D1415 (ISO 48)
  • 2) ASTM D412 (ISO 37)
  • 3) ASTM D412 (ISO 37)
  • 4) ASTM D412 (ISO 37)
  • 5) ASTM D395 Method B ; (ISO 815)