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MNE
Produces vital parts of semiconductor equipments

NANOPURE FFKM O-RINGS

NANOPURE ® HX-8

For Semiconductor CVD Applications

NANO PURE HX-8 is a pure perfluoroelastomer developed as a high-performance material
developed for use in harsh processes of semiconductor and display industry.

NANOPURE HX-8 has been designed to minimize the problems caused by occurrence of
particles with a low etch rate in highly corrosive environments due to plasma. It is also .
suitable for both static and dynamic processes by providing excellent thermal
characteristics and physical strengths.

NANOPURE HX-8 can be used at temperatures up to a maximum of 310 degrees.

Features & Benefit
  • Low erosion rate and particle generation in oxygen and fluorine plasmas
  • Excellent thermal stability
  • Very low metals content
  • Excellent mechanical strength
Suggested Applications
  • Gas inlet seals
  • Chamber lid seals
  • Center ring seals
  • Slit valve door seals
  • Bonded gate valves
Plasma Resistance Test Result

< Conditions >

  • - Gas flow : 150 sccm
  • - Pressure : NF3 150mT, O2 380mT
  • - RF Power : 1,100W
  • - Run time : 30 min.
  • - Temperature : 200℃
Typical Physical Properties
Typical Physical Properties
Color Dark
Auburn
Polymer Type Perfluoro
elastomer
Hardness1), Shore A 74
Tensile Strength at Break2), MPa 11.0
Elongation at Break3), % 250
100% Modulus4), MPa 3.9
Compression Set5), % 70 hours @ 204℃ 16
Compression Set5), % 70 hours @ 250℃ 20
Compression Set5), % 70 hours @ 300℃ 39
Compression Set5), % 70 hours @ 310℃ 43
Maximum Continuous Service,
Temperature, ℃
310
  • 1) ASTM D1415 (ISO 48)
  • 2) ASTM D412 (ISO 37)
  • 3) ASTM D412 (ISO 37)
  • 4) ASTM D412 (ISO 37)
  • 5) ASTM D395 Method B ; (ISO 815)